Welcome to ICSMM 2025
2025 International Conference on Solid Mechanics and Materials will be held on March 14-16, 2025, in Chengdu, Sichuan, China. The aim of this conference is to bring together the top academic forces in the field of solid mechanics and materials at home and abroad to share research results, explore hot issues, exchange new experiences and technologies, and discuss the latest research progress and future development trends in this discipline.
Solid mechanics and materials science is an extremely important basic and applied research field in today's science and technology, covering a variety of aspects such as mechanical properties of materials, deformation behavior, rupture mechanism and so on. With the continuous emergence of new materials and the development of computational mechanics and experimental techniques, this field is undergoing profound changes and rapid progress. The conference will focus on key topics including material strength, toughness, fatigue and their performance in engineering applications, exploring the behavior of a wide range of materials in complex environments and their innovative applications in new energy, aerospace, construction engineering and other fields.
We warmly welcome experts and scholars in related fields to submit their new research or technical contributions to ICSMM 2025 and share their valuable experience with scientists and scholars from all over the world.
Online Submission |
Important Dates
Full Paper Submission Date | Registration Deadline | Final Paper Submission Date | Conference Dates |
December 31, 2024 | March 1, 2025 | February 14, 2025 | March 14-16, 2025 |
Call For Papers
Topics of interest include but are not limited to
· Solid Mechanics
· Experimental Solid Mechanics
· Mechanics of Materials and Structures
· Environmental Mechanics
· Solid Deformation and Principal Structure Theory
· Vibration Theory
· Micromechanics
· Dynamic Mechanical Thermal
· Collision and Impact Analysis
· Dynamic Failure and Failure Mechanism
· Nonlinear Material Model and its Application
· Mechanical Properties
· Elastic Mechanics
· Plastic Mechanics
· Fracture Mechanics
· Contact Mechanics
· Fracture and Damage Mechanics
· Materials
· Nanomaterial Mechanics
· Design and Mechanical Analysis of Metamaterials
· Smart Material and Structure
· Magnetic Material
· Multiferroic and Composite Materials
· Sensor Materials
· Material Processing and Mechanics
· Material Processing and Stress-strain Analysis
· Processing and Application of High Strength Materials
· High Temperature Superconducting
· Applied Mechanics and Material Test
· Mechanics of Biomaterials
· High Temperature Material Mechanics
· Fatigue and Fracture Mechanics of Materials
· Functional Material
· Macromolecular Material
Publication
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
Note: The author can make an oral presentation after the Abstract is accepted and the payment is made.All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act ofplagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Registration Details
1. At least one author for each accepted final paper must pre-register.
2. Registration fees for ICSMM 2025 Regular is 510 USD / 3400 CNY per paper.
3. If the length of the paper exceeds 6 Pages, the cost of Each Extra Page (begin at Page 7) is 60 USD / 400 CNY.
4. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.
5. The registration fee does not include: ① Accommodation ② Visa application fee ③ Transportation fare.
6. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.
7.For those papers that have been accepted and registered, 30 % of the processing fee will be deducted if they need to apply for withdrawal.
Registration Fee
Items | Fee |
Regular Registration (6 pages) | 510 USD / 3400 CNY paper (6 pages) |
| Extra Pages (Begin at Page 7) | 60 USD / 400 CNY extra page |
| Purchase Extra Proceedings/Journal copies | 75 USD / 500 CNY book |
Attendees Without a Submission | 180 USD / 1200 CNY person |
Attendees without a Submission (Groups） | 150 USD / 1000 CNY person (≥ 3 person) |
Program
March 14, 2025
Registration
March 15, 2025
Keynote Speech + Oral Presentation
March 16, 2025
Academic Investigation / Leave
Contact
Conference Secretary: Mr. Li
Tel: +86-17620001794 (WeChat)
▶ Co-organizer
AEIC Academic Exchange Information Center